Job Id: 20200819027
Job Role: AutoCAD Engineer – Package Design
Experience: 5+ Years
Qualification: BS in Electrical / Mechanical Engineering or equivalent
Job Location: Hyderabad
Salary: Best in Industry
Vacancies: Not Mentioned
Job Description Micron Careers Electrical / Mechanical Engineer Job Vacancies in Hyderabad Hiring for AutoCAD Engineer in August 2020:
As an AutoCAD Engineering for ASIC design, you will join a team chartered with designing, implementing and verifying products that fuel Micron’s growth in system level memory solutions. Micron is expanding quickly in various segments of the Solid-State Drive market, managed NAND solutions for mobile applications and other emerging memory and system level technologies. Efficient, high quality implementation and verification of system on chip ASIC designs is a key component of Micron’s success in these products. This role resides in the Central Engineering organization and will require close communication and collaboration with ASIC Architecture, Verification and Implementation teams on needed tools and capabilities. Below is a list of qualifications and experience ideal candidates will possess.
Knowledge and proven ability to communicate complex AutoCAD design with 2D and 3D Design Drafting and Detailing (GD&T)
Demonstrated strong written and verbal communication skills
Advanced understanding of licensing utilization strategies and standardized design environments including foundry PDK integration
Knowledge of IC Package Design Process Cycles is the added advantage
Knowledge of creating Bond Diagram, Package Out Line drawing, Mark Template drawing, Lid drawing, Stiffener drawing, Other Manufacturing drawing is the added advantage
Knowledge on fixing the KOZ region for stiffener and lid packages.
Understanding of database management methods and version control techniques
Understanding of automated regression and continuous integration workflows
Knowledge of software development techniques and automation implementation will be the noticeable one
Should have good knowledge of manufacturing processes
Preferred: Five or more years of experience in Auto CAD Design Engineering, Design Drafting and manufacturing Drawing Generation or CAD operations
Create Design drawings for the IC Packages
Drafting and Detailing of Bond Diagrams, Package Outline Drawings, Mark Template drawing, Lid drawing, Stiffener drawing, Interposer Drawings, and Wire Bond Diagrams &Other Manufacturing drawing is the added advantage.
Responsible on fixing the KOZ region for stiffener and lid packages.
Execute advanced package design reviews in a timely and efficient manner
Perform direct design reviews with assembly subcon design teams
Participate in the DFMEA (Design for Manufacturing) process
Maintain familiarity with documentation workflows and signoff flows
Ensure accurate and timely update of all documents into the Assembly Database
Check and proofread designs from different areas (interposer suppliers, subcons drawings, tooling vendor, etc.
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